Novel SU-8 based vacuum wafer-level packaging for MEMS devices

Research output: Contribution to journalJournal article – Annual report year: 2010Researchpeer-review

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This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility. A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked.
Original languageEnglish
JournalMicroelectronic Engineering
Volume87
Issue number5-8
Pages (from-to)1173-1176
ISSN0167-9317
DOIs
Publication statusPublished - 2010
CitationsWeb of Science® Times Cited: No match on DOI

    Research areas

  • Vacuum packaging, MEMS, SU-8, Wafer-level packaging

ID: 6490363