Double layer resist process scheme for metal lift-off with application in inductive heating of microstructures

Research output: Contribution to journalJournal article – Annual report year: 2010Researchpeer-review

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We present a new method to define metal electrodes on top of high-aspect-ratio microstructures using standard photolithography equipment and a single chromium mask. A lift-off resist (LOR) layer is implemented in an SU-8 photolithography process to selectively remove metal at the end of the processing. In this way, we have successfully defined metal electrodes on top of 75 mu m high SU-8 microstructures to be used as test structures for the measurement of temperature increase due to inductive heating.
Original languageEnglish
JournalMicroelectronic Engineering
Issue number5-8
Pages (from-to)1226-1228
Publication statusPublished - 2010
CitationsWeb of Science® Times Cited: No match on DOI

    Research areas

  • Double layer LOR/positive photoresist lift-off, SU-8 microfabrication, Metallization of high-aspect-ratio structures

ID: 4399766