Bubble formation at grain boundaries in helium implanted copper

Research output: Contribution to journalJournal article – Annual report year: 2004Researchpeer-review

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Original languageEnglish
JournalScripta Materialia
Volume51
Pages (from-to)557-560
ISSN1359-6462
DOIs
Publication statusPublished - 2004
CitationsWeb of Science® Times Cited: No match on DOI

ID: 6175837