Abstract
X-ray diffraction analysis and electrical resistivity measurements were conducted simultaneously for in-situ examination of self-annealing in copper electrodeposits. Considerable growth of the as-deposited nano-sized crystallites occurs with time and the crystallographic texture changes by multiple twinning during self-annealing. The kinetics of self-annealing depends on the layer thickness as well as on the orientation and/or the size of the as-deposited crystallites. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Original language | English |
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Journal | Scripta Materialia |
Volume | 55 |
Issue number | 4 |
Pages (from-to) | 283-286 |
ISSN | 1359-6462 |
DOIs | |
Publication status | Published - 2006 |