Water Penetration Study for a 3D Electronic Patch

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Original languageEnglish
Title of host publicationIMAPS International Conference and Exhibition on Device Packaging
Publication date2008
Pages41-46
Publication statusPublished - 2008
Externally publishedYes
EventIMAPS 4th International Conference and Exhibition on Device Packaging - Scottsdale, Arizona, United States
Duration: 15 Mar 200820 Mar 2008

Conference

ConferenceIMAPS 4th International Conference and Exhibition on Device Packaging
CountryUnited States
CityScottsdale, Arizona
Period15/03/200820/03/2008

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