Wafer through-hole interconnections with high vertical wiring                densities

Carsten Christensen, Peter Kersten, Sascha Henke, Siebe Bouwstra

Research output: Contribution to journal › Journal article › Research › peer-review

Original language	English
Journal	IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)
Volume	A19
Pages (from-to)	516-522
ISSN	1070-9886
Publication status	Published - 1996

Cite this

@article{977c143bbbec4aed96597c40d7c8464b,

title = "Wafer through-hole interconnections with high vertical wiring densities",

author = "Carsten Christensen and Peter Kersten and Sascha Henke and Siebe Bouwstra",

year = "1996",

language = "English",

volume = "A19",

pages = "516--522",

journal = "IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)",

issn = "1070-9886",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

Research output: Contribution to journal › Journal article › Research › peer-review

TY - JOUR

T1 - Wafer through-hole interconnections with high vertical wiring densities

AU - Christensen, Carsten

AU - Kersten, Peter

AU - Henke, Sascha

AU - Bouwstra, Siebe

PY - 1996

Y1 - 1996

M3 - Journal article

VL - A19

SP - 516

EP - 522

JO - IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)

JF - IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)

SN - 1070-9886

ER -