Wafer through-hole interconnections with high vertical wiring densities

Carsten Christensen, Peter Kersten, Sascha Henke, Siebe Bouwstra

    Research output: Contribution to journalJournal articleResearchpeer-review

    Original languageEnglish
    JournalIEEE transactions on components, packaging, and manufacturing technology. Part A (Print)
    VolumeA19
    Pages (from-to)516-522
    ISSN1070-9886
    Publication statusPublished - 1996

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