| Original language | English |
|---|---|
| Title of host publication | EuPac 96 |
| Place of Publication | Essen, Germany |
| Publication date | 1996 |
| Pages | 81-82 |
| Publication status | Published - 1996 |
Wafer through-hole interconnections for high vertical wiring densities
Carsten Christensen, Siebe Bouwstra, Jon Wulff Petersen
Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review