Wafer Level Characterization of Row-Column Addressed CMUT Arrays

Erik Vilain Thomsen, Kitty Steenberg, Magnus G. Petersen, Mads Alexander Weile, Andreas Spandet Havreland, Martin Lind Ommen, Rune Sixten Grass, Mathias Engholm

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review


This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.
Original languageEnglish
Title of host publicationProceedings of 2019 IEEE International Ultrasonics Symposium
Publication date2019
ISBN (Electronic) 978-1-7281-4596-9
Publication statusPublished - 2019
Event2019 IEEE International Ultrasonics Symposium - SEC Glasgow, Glasgow, United Kingdom
Duration: 6 Oct 20199 Oct 2019


Conference2019 IEEE International Ultrasonics Symposium
LocationSEC Glasgow
Country/TerritoryUnited Kingdom
Internet address


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