Wafer Level Characterization of Row-Column Addressed CMUT Arrays

Erik Vilain Thomsen; Kitty Steenberg; Magnus G. Petersen; Mads Alexander Weile; Andreas Spandet Havreland; Martin Lind Ommen; Rune Sixten Grass; Mathias Engholm

doi:10.1109/ultsym.2019.8926136

Wafer Level Characterization of Row-Column Addressed CMUT Arrays

Erik Vilain Thomsen, Kitty Steenberg, Magnus G. Petersen, Mads Alexander Weile, Andreas Spandet Havreland, Martin Lind Ommen, Rune Sixten Grass, Mathias Engholm

Department of Health Technology

Technical University of Denmark

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.

Original language	English
Title of host publication	Proceedings of 2019 IEEE International Ultrasonics Symposium
Publisher	IEEE
Publication date	2019
Pages	770-773
ISBN (Electronic)	978-1-7281-4596-9
DOIs	https://doi.org/10.1109/ultsym.2019.8926136
Publication status	Published - 2019
Event	2019 IEEE International Ultrasonics Symposium - SEC Glasgow, Glasgow, United Kingdom Duration: 6 Oct 2019 → 9 Oct 2019 http://attend.ieee.org/ius-2019/

Conference

Conference	2019 IEEE International Ultrasonics Symposium
Location	SEC Glasgow
Country/Territory	United Kingdom
City	Glasgow
Period	06/10/2019 → 09/10/2019
Internet address	http://attend.ieee.org/ius-2019/

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@inproceedings{cd74deb40c1b4b84ab30e92b4c93236a,

title = "Wafer Level Characterization of Row-Column Addressed CMUT Arrays",

abstract = "This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.",

author = "Thomsen, {Erik Vilain} and Kitty Steenberg and Petersen, {Magnus G.} and Weile, {Mads Alexander} and Havreland, {Andreas Spandet} and Ommen, {Martin Lind} and Grass, {Rune Sixten} and Mathias Engholm",

year = "2019",

doi = "10.1109/ultsym.2019.8926136",

language = "English",

pages = "770--773",

booktitle = "Proceedings of 2019 IEEE International Ultrasonics Symposium",

publisher = "IEEE",

address = "United States",

note = "2019 IEEE International Ultrasonics Symposium, IUS 2019 ; Conference date: 06-10-2019 Through 09-10-2019",

url = "http://attend.ieee.org/ius-2019/",

}

Thomsen, EV , Steenberg, K, Petersen, MG, Weile, MA, Havreland, AS, Ommen, ML, Grass, RS & Engholm, M 2019, Wafer Level Characterization of Row-Column Addressed CMUT Arrays. in Proceedings of 2019 IEEE International Ultrasonics Symposium. IEEE, pp. 770-773, 2019 IEEE International Ultrasonics Symposium, Glasgow, United Kingdom, 06/10/2019. https://doi.org/10.1109/ultsym.2019.8926136

TY - GEN

T1 - Wafer Level Characterization of Row-Column Addressed CMUT Arrays

AU - Thomsen, Erik Vilain

AU - Steenberg, Kitty

AU - Petersen, Magnus G.

AU - Weile, Mads Alexander

AU - Havreland, Andreas Spandet

AU - Ommen, Martin Lind

AU - Grass, Rune Sixten

AU - Engholm, Mathias

PY - 2019

Y1 - 2019

N2 - This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.

AB - This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.

U2 - 10.1109/ultsym.2019.8926136

DO - 10.1109/ultsym.2019.8926136

M3 - Article in proceedings

SP - 770

EP - 773

BT - Proceedings of 2019 IEEE International Ultrasonics Symposium

PB - IEEE

T2 - 2019 IEEE International Ultrasonics Symposium

Y2 - 6 October 2019 through 9 October 2019

ER -

Wafer Level Characterization of Row-Column Addressed CMUT Arrays

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