Wafer Level Characterization of Row-Column Addressed CMUT Arrays

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.
Original languageEnglish
Title of host publicationProceedings of 2019 IEEE International Ultrasonics Symposium
PublisherIEEE
Publication date2019
Pages770-773
ISBN (Electronic) 978-1-7281-4596-9
DOIs
Publication statusPublished - 2019
Event2019 IEEE International Ultrasonics Symposium - SEC Glasgow, Glasgow, United Kingdom
Duration: 6 Oct 20199 Oct 2019
http://attend.ieee.org/ius-2019/

Conference

Conference2019 IEEE International Ultrasonics Symposium
LocationSEC Glasgow
CountryUnited Kingdom
CityGlasgow
Period06/10/201909/10/2019
Internet address

Cite this

Thomsen, E. V., Steenberg, K., Petersen, M. G., Weile, M. A., Havreland, A. S., Ommen, M. L., ... Engholm, M. (2019). Wafer Level Characterization of Row-Column Addressed CMUT Arrays. In Proceedings of 2019 IEEE International Ultrasonics Symposium (pp. 770-773). IEEE. https://doi.org/10.1109/ultsym.2019.8926136
Thomsen, Erik Vilain ; Steenberg, Kitty ; Petersen, Magnus G. ; Weile, Mads Alexander ; Havreland, Andreas Spandet ; Ommen, Martin Lind ; Grass, Rune Sixten ; Engholm, Mathias. / Wafer Level Characterization of Row-Column Addressed CMUT Arrays. Proceedings of 2019 IEEE International Ultrasonics Symposium. IEEE, 2019. pp. 770-773
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title = "Wafer Level Characterization of Row-Column Addressed CMUT Arrays",
abstract = "This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.",
author = "Thomsen, {Erik Vilain} and Kitty Steenberg and Petersen, {Magnus G.} and Weile, {Mads Alexander} and Havreland, {Andreas Spandet} and Ommen, {Martin Lind} and Grass, {Rune Sixten} and Mathias Engholm",
year = "2019",
doi = "10.1109/ultsym.2019.8926136",
language = "English",
pages = "770--773",
booktitle = "Proceedings of 2019 IEEE International Ultrasonics Symposium",
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Thomsen, EV, Steenberg, K, Petersen, MG, Weile, MA, Havreland, AS, Ommen, ML, Grass, RS & Engholm, M 2019, Wafer Level Characterization of Row-Column Addressed CMUT Arrays. in Proceedings of 2019 IEEE International Ultrasonics Symposium. IEEE, pp. 770-773, 2019 IEEE International Ultrasonics Symposium, Glasgow, United Kingdom, 06/10/2019. https://doi.org/10.1109/ultsym.2019.8926136

Wafer Level Characterization of Row-Column Addressed CMUT Arrays. / Thomsen, Erik Vilain; Steenberg, Kitty; Petersen, Magnus G.; Weile, Mads Alexander; Havreland, Andreas Spandet; Ommen, Martin Lind; Grass, Rune Sixten; Engholm, Mathias.

Proceedings of 2019 IEEE International Ultrasonics Symposium. IEEE, 2019. p. 770-773.

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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T1 - Wafer Level Characterization of Row-Column Addressed CMUT Arrays

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AU - Ommen, Martin Lind

AU - Grass, Rune Sixten

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AB - This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.

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Thomsen EV, Steenberg K, Petersen MG, Weile MA, Havreland AS, Ommen ML et al. Wafer Level Characterization of Row-Column Addressed CMUT Arrays. In Proceedings of 2019 IEEE International Ultrasonics Symposium. IEEE. 2019. p. 770-773 https://doi.org/10.1109/ultsym.2019.8926136