Wafer Level Characterization of Row-Column Addressed CMUT Arrays

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Abstract

This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device. This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.
Original languageEnglish
Title of host publicationProceedings of 2019 IEEE International Ultrasonics Symposium
PublisherIEEE
Publication date2019
Pages770-773
ISBN (Electronic) 978-1-7281-4596-9
DOIs
Publication statusPublished - 2019
Event2019 IEEE International Ultrasonics Symposium - SEC Glasgow, Glasgow, United Kingdom
Duration: 6 Oct 20199 Oct 2019
http://attend.ieee.org/ius-2019/

Conference

Conference2019 IEEE International Ultrasonics Symposium
LocationSEC Glasgow
CountryUnited Kingdom
CityGlasgow
Period06/10/201909/10/2019
Internet address

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