Wafer bonding for microstructure packaging and formation

Steen Weichel

    Research output: Book/ReportBookResearchpeer-review

    Original languageEnglish
    Place of PublicationLyngby
    PublisherMIC
    Number of pages161
    Publication statusPublished - 2000

    Cite this

    Weichel, Steen. / Wafer bonding for microstructure packaging and formation. Lyngby : MIC, 2000. 161 p.
    @book{63258dd6494a4f9b9f12d8ccf6c3e81e,
    title = "Wafer bonding for microstructure packaging and formation",
    author = "Steen Weichel",
    year = "2000",
    language = "English",
    publisher = "MIC",

    }

    Wafer bonding for microstructure packaging and formation. / Weichel, Steen.

    Lyngby : MIC, 2000. 161 p.

    Research output: Book/ReportBookResearchpeer-review

    TY - BOOK

    T1 - Wafer bonding for microstructure packaging and formation

    AU - Weichel, Steen

    PY - 2000

    Y1 - 2000

    M3 - Book

    BT - Wafer bonding for microstructure packaging and formation

    PB - MIC

    CY - Lyngby

    ER -

    Weichel S. Wafer bonding for microstructure packaging and formation. Lyngby: MIC, 2000. 161 p.