Throughout the evolution of microelectronics, the electrochemical deposition technique has played a vital role in manufacturing of printed circuit boards (PCB´s),in deposition of materials for packaging processes such as flip-chip bonding and recently also in fabrication of interconnects for ultra large scale integrated (ULSI) circuits. During the last 5 to 10 years electrochemical deposition has also achieved attention as a tool for manufacturing of micro electromechanical systems (MEMS), microfluidic and optical systems (creating inserts for the injection moulding of polymer optics or microfluidic systems) and many other areas within the field of micro systems technology (MST). The present paper describes some applications for which electrodeposition of various metals have been utilised for manufacturing of MEMS and modern interconnect components.
|Title of host publication||CIRP Seminar on Micro and Nano Technology|
|Publication status||Published - 2003|
|Event||1st CIRP seminar on Micro and Nano Technology - Technical University of Denmark, Copenhagen, Denmark|
Duration: 13 Nov 2003 → 14 Nov 2003
|Conference||1st CIRP seminar on Micro and Nano Technology|
|Location||Technical University of Denmark|
|Period||13/11/2003 → 14/11/2003|