Utilisation of Electrochemical Deposition as a Tool for Manufactuing of Micro Components

Peter Torben Tang, Jens Dahl Jensen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    Throughout the evolution of microelectronics, the electrochemical deposition technique has played a vital role in manufacturing of printed circuit boards (PCB´s),in deposition of materials for packaging processes such as flip-chip bonding and recently also in fabrication of interconnects for ultra large scale integrated (ULSI) circuits. During the last 5 to 10 years electrochemical deposition has also achieved attention as a tool for manufacturing of micro electromechanical systems (MEMS), microfluidic and optical systems (creating inserts for the injection moulding of polymer optics or microfluidic systems) and many other areas within the field of micro systems technology (MST). The present paper describes some applications for which electrodeposition of various metals have been utilised for manufacturing of MEMS and modern interconnect components.
    Original languageEnglish
    Title of host publicationCIRP Seminar on Micro and Nano Technology
    Publication date2003
    Publication statusPublished - 2003
    Event1st CIRP seminar on Micro and Nano Technology - Technical University of Denmark, Copenhagen, Denmark
    Duration: 13 Nov 200314 Nov 2003

    Conference

    Conference1st CIRP seminar on Micro and Nano Technology
    LocationTechnical University of Denmark
    CountryDenmark
    CityCopenhagen
    Period13/11/200314/11/2003

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