Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems

Kasper Kistrup, Carl Esben Poulsen, Mikkel Fougt Hansen, Anders Wolff

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    Ultrasonic welding is a rapid, promising bonding method for the bonding of polymer chips; yet its use is still limited. We present two lab-on-a-chip applications where ultrasonic welding can be preferably applied: (1) Self-aligned gapless bonding of a two-part chip with a tolerance of 50 um; (2) bonding of a large area shallow chamber (1.8 cm^2 X 150 um). Using injection moulding combined with ultrasonic welding we achieved a total production and bonding time of 60 s per chip, and a batch of chips could be produced within a day going from design to finished chips. We believe that the technical solutions offered here can significantly help bridge the gap between academia and industry, where the differences in production methods and materials pose a challenge when transferring technology.
    Original languageEnglish
    JournalLab on a Chip
    Volume15
    Pages (from-to)1998–2001
    ISSN1473-0197
    DOIs
    Publication statusPublished - 2015

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