In the period from month 24 to month 30 focus has been on the work-package 3 activities concerning optimisation of the newly developed ULTRAPLATE technology towards specific industrial applications. Three main application areas have been pursued: 1) High- speed plating of lead free solder contacts, 2) electroforming of tools for moulding of low-cost precision polymer devices and 3) deposition of magnetic alloys to be used in new planar micro-devices.
Within each of the three studied application areas, the targeted output is a finished demonstrator to show the potential of the new ULTRAPLATE technology.
|Number of pages||21|
|Publication status||Published - 2003|