Two component micro injection molding for MID fabrication

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    Abstract

    Molded Interconnect Devices (MIDs) are plastic substrates with electrical infrastructure. The fabrication of MIDs is usually based on injection molding and different process chains may be identified from this starting point. The use of MIDs has been driven primarily by the automotive sector, but recently the medical sector seems more and more interested. In particular the possibility of miniaturization of 3D components with electrical infrastructure is attractive. The paper describes possible manufacturing routes and challenges of miniaturized MIDs based on two component micro injection molding and subsequent metallization. The technology will be demonstrated by an industrial component.
    Original languageEnglish
    Title of host publicationANTEC 2009 Annual Technical Conference, Chicago, Illinois USA : ANTEC@NPE 2009
    Place of PublicationChicago, Illinois USA
    Publication date2009
    Publication statusPublished - 2009
    Event67th Annual Technical Conference of the Society Of Plastics Engineers 2009 - Chicago, IL, United States
    Duration: 22 Jun 200924 Jun 2009
    Conference number: 67

    Conference

    Conference67th Annual Technical Conference of the Society Of Plastics Engineers 2009
    Number67
    Country/TerritoryUnited States
    CityChicago, IL
    Period22/06/200924/06/2009

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