Twin stability in highly nanotwinned Cu under compression, torsion and tension

A.M. Hodge, T.A. Furnish, C.J. Shute, Y. Liao, Xiaoxu Huang, Chuanshi Hong, Y.T. Zhu, T.W. Barbee Jr., J.R. Weertman

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    Abstract

    Twin stability under four distinct mechanical loading states has been investigated for highly nanotwinned Cu containing parallel nanotwins 40 nm thick. Observed deformation-induced microstructural changes under tension, compression, tension–tension fatigue and torsion are qualitatively compared in order to assess twin stability as a function of the loading direction and stress. It is observed that the twins are very stable although small microstructural changes vary with deformation mode. Shear bands, deformation-induced grain growth and detwinning are also discussed.
    © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
    Original languageEnglish
    JournalScripta Materialia
    Volume66
    Issue number11
    Pages (from-to)872-877
    ISSN1359-6462
    DOIs
    Publication statusPublished - 2012

    Bibliographical note

    Viewpoint set no. 49: Strengthening effect of nano-scale twins

    Keywords

    • Nanotwinned
    • Copper
    • Plastic deformation
    • Nanostructure

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