Twin stability in highly nanotwinned Cu under compression, torsion and tension

A.M. Hodge, T.A. Furnish, C.J. Shute, Y. Liao, Xiaoxu Huang, Chuanshi Hong, Y.T. Zhu, T.W. Barbee Jr., J.R. Weertman

    Research output: Contribution to journalJournal articleResearchpeer-review

    587 Downloads (Pure)

    Abstract

    Twin stability under four distinct mechanical loading states has been investigated for highly nanotwinned Cu containing parallel nanotwins 40 nm thick. Observed deformation-induced microstructural changes under tension, compression, tension–tension fatigue and torsion are qualitatively compared in order to assess twin stability as a function of the loading direction and stress. It is observed that the twins are very stable although small microstructural changes vary with deformation mode. Shear bands, deformation-induced grain growth and detwinning are also discussed.
    © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
    Original languageEnglish
    JournalScripta Materialia
    Volume66
    Issue number11
    Pages (from-to)872-877
    ISSN1359-6462
    DOIs
    Publication statusPublished - 2012

    Bibliographical note

    Viewpoint set no. 49: Strengthening effect of nano-scale twins

    Keywords

    • Nanotwinned
    • Copper
    • Plastic deformation
    • Nanostructure

    Fingerprint

    Dive into the research topics of 'Twin stability in highly nanotwinned Cu under compression, torsion and tension'. Together they form a unique fingerprint.

    Cite this