The microstructure of (Bi,Pb)(2)Sr2Ca2CuOx (Bi-2223) tapes has been investigated by means of transmission electron microscopy (TEM) and high-resolution TEM. The emphasis has been placed on: (1) an examination of the grain morphology and size, (2) grain and colony boundary angles, which are formed during the tape processing, (3) a study of the grain boundaries on an atomic scale, including intergrowth investigations. Tapes with different process parameters have been compared with respect to the microstructure. A fully processed tape has on the average 50% thicker Bi-2223 grains than a tape after the first annealing. The angles of c-axis tilt grain boundaries are on average 14 degrees and 26 degrees for the fully processed tape and the tape after the first annealing, respectively. The intergrowth content(15%) and distribution are similar in these two tapes. (C) 2001 Elsevier Science B.V. All rights reserved.
Andersen, L. G., Bals, S., Tendeloo, G. V., Poulsen, H. F., & Liu, Y. L. (2001). Transmission electron microscopy investigation of Bi-2223/Ag tapes. Physica C: Superconductivity and its Applications, 353(3-4), 251-257. https://doi.org/10.1016/S0921-4534(00)01755-X