Transmission electron microscopy investigation of Bi-2223/Ag tapes

L.G. Andersen, S. Bals, G. Van Tendeloo, H.F. Poulsen, Y.L. Liu

    Research output: Contribution to journalJournal articleResearchpeer-review

    Abstract

    The microstructure of (Bi,Pb)(2)Sr2Ca2CuOx (Bi-2223) tapes has been investigated by means of transmission electron microscopy (TEM) and high-resolution TEM. The emphasis has been placed on: (1) an examination of the grain morphology and size, (2) grain and colony boundary angles, which are formed during the tape processing, (3) a study of the grain boundaries on an atomic scale, including intergrowth investigations. Tapes with different process parameters have been compared with respect to the microstructure. A fully processed tape has on the average 50% thicker Bi-2223 grains than a tape after the first annealing. The angles of c-axis tilt grain boundaries are on average 14 degrees and 26 degrees for the fully processed tape and the tape after the first annealing, respectively. The intergrowth content(15%) and distribution are similar in these two tapes. (C) 2001 Elsevier Science B.V. All rights reserved.
    Original languageEnglish
    JournalPhysica C: Superconductivity and its Applications
    Volume353
    Issue number3-4
    Pages (from-to)251-257
    ISSN0921-4534
    DOIs
    Publication statusPublished - 2001

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