Towards a microscopic understanding of plasma activated bonding

M. Poulsen, A. Egebjerg, O. Bunk, M. Nielsen, M.M. Nielsen, R. Feidenhans'l, F. Jensen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationSemiconductor wafer bonding 7: Science, technology, and applications
    Place of PublicationPennington, NJ
    PublisherThe Electrochemical Society
    Publication date2004
    Pages248-258
    Publication statusPublished - 2004
    Event203rd Meeting of the Electrochemical Society - Paris, France
    Duration: 28 Apr 200330 Apr 2003
    Conference number: 203
    http://www.electrochem.org/meetings/biannual/203/203exhibit.htm

    Conference

    Conference203rd Meeting of the Electrochemical Society
    Number203
    CountryFrance
    CityParis
    Period28/04/200330/04/2003
    Internet address
    SeriesProceedings volume PV 2003-19

    Cite this

    Poulsen, M., Egebjerg, A., Bunk, O., Nielsen, M., Nielsen, M. M., Feidenhans'l, R., & Jensen, F. (2004). Towards a microscopic understanding of plasma activated bonding. In Semiconductor wafer bonding 7: Science, technology, and applications (pp. 248-258). The Electrochemical Society. Proceedings volume PV 2003-19