Towards a microscopic understanding of plasma activated bonding

M. Poulsen; A. Egebjerg; O. Bunk; M. Nielsen; M.M. Nielsen; R. Feidenhans'l; F. Jensen

Towards a microscopic understanding of plasma activated bonding

M. Poulsen, A. Egebjerg, O. Bunk, M. Nielsen, M.M. Nielsen, R. Feidenhans'l, F. Jensen

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Semiconductor wafer bonding 7: Science, technology, and applications
Place of Publication	Pennington, NJ
Publisher	The Electrochemical Society
Publication date	2004
Pages	248-258
Publication status	Published - 2004
Event	203rd Meeting of The Electrochemical Society - Paris, France Duration: 27 Apr 2003 → 2 May 2003 Conference number: 203

Conference

Conference	203rd Meeting of The Electrochemical Society
Number	203
Country/Territory	France
City	Paris
Period	27/04/2003 → 02/05/2003

Series	Proceedings volume PV 2003-19

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@inproceedings{cab1882422d6465b8538c72359de8757,

title = "Towards a microscopic understanding of plasma activated bonding",

keywords = "5-I nano",

author = "M. Poulsen and A. Egebjerg and O. Bunk and M. Nielsen and M.M. Nielsen and R. Feidenhans'l and F. Jensen",

year = "2004",

language = "English",

series = "Proceedings volume PV 2003-19",

pages = "248--258",

booktitle = "Semiconductor wafer bonding 7: Science, technology, and applications",

publisher = "The Electrochemical Society",

note = "203rd Meeting of The Electrochemical Society, ECS2003 ; Conference date: 27-04-2003 Through 02-05-2003",

}

Poulsen, M, Egebjerg, A, Bunk, O, Nielsen, M, Nielsen, MM, Feidenhans'l, R & Jensen, F 2004, Towards a microscopic understanding of plasma activated bonding. in Semiconductor wafer bonding 7: Science, technology, and applications. The Electrochemical Society, Pennington, NJ, Proceedings volume PV 2003-19, pp. 248-258, 203rd Meeting of The Electrochemical Society, Paris, France, 27/04/2003.

Towards a microscopic understanding of plasma activated bonding. / Poulsen, M.; Egebjerg, A.; Bunk, O. et al.
Semiconductor wafer bonding 7: Science, technology, and applications. Pennington, NJ: The Electrochemical Society, 2004. p. 248-258 (Proceedings volume PV 2003-19).

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Towards a microscopic understanding of plasma activated bonding

AU - Poulsen, M.

AU - Egebjerg, A.

AU - Bunk, O.

AU - Nielsen, M.

AU - Nielsen, M.M.

AU - Feidenhans'l, R.

AU - Jensen, F.

N1 - Conference code: 203

PY - 2004

Y1 - 2004

KW - 5-I nano

M3 - Article in proceedings

T3 - Proceedings volume PV 2003-19

SP - 248

EP - 258

BT - Semiconductor wafer bonding 7: Science, technology, and applications

PB - The Electrochemical Society

CY - Pennington, NJ

T2 - 203rd Meeting of The Electrochemical Society

Y2 - 27 April 2003 through 2 May 2003

ER -