Tin-Silver Alloys for Flip-Chip Bonding Studied with a Rotating Cylinder Electrode

Peter Torben Tang, E.H. Pedersen, G. Bech-Nielsen, Jochen Kuhmann

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Abstract

    Electrodeposition of solder for flip-chip bonding is studied in the form of a pyrophosphate/iodide tin-silver alloy bath. The objective is to obtain a uniform alloy composition, with 3.8 At.% silver, over a larger area. This specific alloy will provide an eutectic solder melting at 221°C (or 10°C below pure tin). Depositions on a rotating cylinder electrode (with current screen), followed by composition measurements, provided useful information on the relationship between current density and alloy composition. Preliminary experiments with alloy plating on silicon substrates, with and without photoresist, have shown a stable and promising alternative to pure tin and tin-lead alloys for flip-chip bonding applications.
    Original languageEnglish
    Title of host publication196th meeting of the Electrochemical Society
    PublisherThe Electrochemical Society
    Publication date1999
    Publication statusPublished - 1999
    Event196th Meeting of the Electrochemical Society - Honolulu, Hawaii, United States
    Duration: 17 Oct 199922 Oct 1999
    http://www.electrochem.org/meetings/

    Conference

    Conference196th Meeting of the Electrochemical Society
    CountryUnited States
    CityHonolulu, Hawaii
    Period17/10/199922/10/1999
    Internet address

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