Through wafer interconnects and flip-chip bonding: A toolbox
                for advanced hybrid technologies for MEMS.

Jochen Friedrich Kuhmann, Matthias Heschel, Siebe Bouwstra, F. Baleras, C. Massit

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.
Publication date	1999
Pages	265-72
Publication status	Published - 1999
Event	13th European Conference on Solid-State Transducers - The Hague, Netherlands Duration: 12 Sept 1999 → 15 Sept 1999 Conference number: 13

Conference	13th European Conference on Solid-State Transducers
Number	13
Country/Territory	Netherlands
City	The Hague
Period	12/09/1999 → 15/09/1999

OpenUrl availability

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title = "Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.",

author = "Kuhmann, {Jochen Friedrich} and Matthias Heschel and Siebe Bouwstra and F. Baleras and C. Massit",

year = "1999",

language = "English",

pages = "265--72",

booktitle = "Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.",

note = "13th European Conference on Solid-State Transducers, EUROSENSORS XIII ; Conference date: 12-09-1999 Through 15-09-1999",

}

Kuhmann, JF, Heschel, M, Bouwstra, S, Baleras, F & Massit, C 1999, Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS. in Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.. pp. 265-72, 13th European Conference on Solid-State Transducers, The Hague, Netherlands, 12/09/1999.

Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS. / Kuhmann, Jochen Friedrich; Heschel, Matthias; Bouwstra, Siebe et al.
Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.. 1999. p. 265-72.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.

AU - Kuhmann, Jochen Friedrich

AU - Heschel, Matthias

AU - Bouwstra, Siebe

AU - Baleras, F.

AU - Massit, C.

N1 - Conference code: 13

PY - 1999

Y1 - 1999

M3 - Article in proceedings

SP - 265

EP - 272

BT - Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.

T2 - 13th European Conference on Solid-State Transducers

Y2 - 12 September 1999 through 15 September 1999

ER -