Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.

Jochen Friedrich Kuhmann, Matthias Heschel, Siebe Bouwstra, F. Baleras, C. Massit

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationThrough wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS.
    Publication date1999
    Pages265-72
    Publication statusPublished - 1999
    Event13th European Conference on Solid-State Transducers - The Hague, Netherlands
    Duration: 12 Sep 199915 Sep 1999
    Conference number: 13

    Conference

    Conference13th European Conference on Solid-State Transducers
    Number13
    CountryNetherlands
    CityThe Hague
    Period12/09/199915/09/1999

    Cite this

    Kuhmann, J. F., Heschel, M., Bouwstra, S., Baleras, F., & Massit, C. (1999). Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS. In Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS. (pp. 265-72)