Thermal characterization of a micro polishing machine and effect on path strategy compensation

Soufian Ben Achour*, Alessandro Checchi, Giuliano Bissacco, Leonardo De Chiffre

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsResearchpeer-review

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    Abstract

    Micro polishing is an important process when fine surface quality and low form error are required in the micro scale domain. This process has several differences from conventional polishing and some of the factors can not be neglected any longer. In this work, a study on the thermal behaviour of a micro hexapod-based machine is conducted. The main causes of thermal deformations are addressed and analysed. The contributions are then evaluated and compensation path strategies are discussed. The main criticalities when dealing with micro polishing are due to the small tools used. Micro tools require higher speeds than conventional polishing. High spindle speeds generate heat and therefore thermal deformations. This adds up to the movement of the Hexapod while performing polishing. The observed total deformation in the polishing tool axial direction reached 8.2 μm. Such a large deformation can introduce a potential error in the final material removal up to 50% if not adequately compensated.
    Original languageEnglish
    Title of host publicationProceedings of the 19th International Conference and Exhibition (EUSPEN 2019)
    EditorsC. Nisbet, R. K. Leach , D. Billington, D. Phillips
    PublisherThe European Society for Precision Engineering and Nanotechnology
    Publication date2019
    Pages446-447
    ISBN (Electronic)978-099577514-5
    Publication statusPublished - 2019
    Eventeuspen's 19th International Conference & Exhibition - Bilbao, Spain
    Duration: 3 Jun 20197 Jun 2019

    Conference

    Conferenceeuspen's 19th International Conference & Exhibition
    Country/TerritorySpain
    CityBilbao
    Period03/06/201907/06/2019

    Keywords

    • Micro polishing
    • Thermal stability
    • Compensation

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