Thermal characterization of a micro polishing machine and effect on path strategy compensation

Soufian Ben Achour*, Alessandro Checchi, Giuliano Bissacco, Leonardo De Chiffre

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsResearchpeer-review

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Abstract

Micro polishing is an important process when fine surface quality and low form error are required in the micro scale domain. This process has several differences from conventional polishing and some of the factors can not be neglected any longer. In this work, a study on the thermal behaviour of a micro hexapod-based machine is conducted. The main causes of thermal deformations are addressed and analysed. The contributions are then evaluated and compensation path strategies are discussed. The main criticalities when dealing with micro polishing are due to the small tools used. Micro tools require higher speeds than conventional polishing. High spindle speeds generate heat and therefore thermal deformations. This adds up to the movement of the Hexapod while performing polishing. The observed total deformation in the polishing tool axial direction reached 8.2 μm. Such a large deformation can introduce a potential error in the final material removal up to 50% if not adequately compensated.
Original languageEnglish
Title of host publicationProceedings of the 19th International Conference and Exhibition (EUSPEN 2019)
EditorsC. Nisbet, R. K. Leach , D. Billington, D. Phillips
PublisherThe European Society for Precision Engineering and Nanotechnology
Publication date2019
Pages446-447
ISBN (Electronic)978-099577514-5
Publication statusPublished - 2019
Eventeuspen's 19th International Conference & Exhibition - Bilbao, Spain
Duration: 3 Jun 20197 Jun 2019

Conference

Conferenceeuspen's 19th International Conference & Exhibition
CountrySpain
CityBilbao
Period03/06/201907/06/2019

Keywords

  • Micro polishing
  • Thermal stability
  • Compensation

Cite this

Ben Achour, S., Checchi, A., Bissacco, G., & De Chiffre, L. (2019). Thermal characterization of a micro polishing machine and effect on path strategy compensation. In C. Nisbet, R. K. Leach , D. Billington, & D. Phillips (Eds.), Proceedings of the 19th International Conference and Exhibition (EUSPEN 2019) (pp. 446-447). The European Society for Precision Engineering and Nanotechnology.