Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

J. Sopousek; Marián Palcut; Erika Hodúlová; Jozef Janovec

doi:10.1007/s11664-009-1070-2

Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

J. Sopousek, Marián Palcut, Erika Hodúlová, Jozef Janovec

Research output: Contribution to journal › Journal article › Research › peer-review

Abstract

The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

Original language	English
Journal	Journal of Electronic Materials
Volume	39
Issue number	3
Pages (from-to)	312-317
ISSN	0361-5235
DOIs	https://doi.org/10.1007/s11664-009-1070-2
Publication status	Published - 2010

Keywords

Solid Oxide Fuel Cells
Fuel Cells and hydrogen

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title = "Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy",

abstract = "The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.",

keywords = "Solid Oxide Fuel Cells, Fuel Cells and hydrogen, Br{\ae}ndselsceller og brint",

author = "J. Sopousek and Mari{\'a}n Palcut and Erika Hod{\'u}lov{\'a} and Jozef Janovec",

year = "2010",

doi = "10.1007/s11664-009-1070-2",

language = "English",

volume = "39",

pages = "312--317",

journal = "Journal of Electronic Materials",

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T1 - Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

AU - Sopousek, J.

AU - Palcut, Marián

AU - Hodúlová, Erika

AU - Janovec, Jozef

PY - 2010

Y1 - 2010

N2 - The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

AB - The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

KW - Solid Oxide Fuel Cells

KW - Fuel Cells and hydrogen

KW - Brændselsceller og brint

U2 - 10.1007/s11664-009-1070-2

DO - 10.1007/s11664-009-1070-2

M3 - Journal article

VL - 39

SP - 312

EP - 317

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

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