Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

J. Sopousek, Marián Palcut, Erika Hodúlová, Jozef Janovec

    Research output: Contribution to journalJournal articleResearchpeer-review


    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.
    Original languageEnglish
    JournalJournal of Electronic Materials
    Issue number3
    Pages (from-to)312-317
    Publication statusPublished - 2010


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