The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement

Dongfang Dai; Jincheng Li; Jing Qian; Zeping Wang; Kai Zheng; Jiabing Yu; Xianping Chen

doi:10.1016/j.matlet.2023.134087

The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement

Dongfang Dai, Jincheng Li, Jing Qian, Zeping Wang^*, Kai Zheng, Jiabing Yu, Xianping Chen^*

^*Corresponding author for this work

Chongqing University

Research output: Contribution to journal › Letter › peer-review

Abstract

Highly conductive and robust Cu-Cu jonts are achieved by the low temperature sintering of Cu nanoparticles (Cu NPs) with a formic acid treatment. When sintered at 300 °C, the Cu-Cu joints exhibited a low resistivity of 4.79 µΩ·cm with a shear strength larger than 30 MPa. In addition, unique oxidation-enhancing effect of Cu-Cu joints is discovered in thermal storage experiments. When thermal storage at 50 h, the strength of the joints increases to 39.25 MPa, while the resistivity is only increased by a factor of 5.78. This discovery provides a potential packaging enhancement process for practical application of electronic devices.

Original language	English
Article number	134087
Journal	Materials Letters
Volume	339
Number of pages	5
ISSN	0167-577X
DOIs	https://doi.org/10.1016/j.matlet.2023.134087
Publication status	Published - 2023

Bibliographical note

This work was supported in part by the National Natural Science Foundation of China under Grant 62071073 and in part by the Foundation from Guangxi Key Laboratory of Optoelectronic Information Processing under Grant GD20201.

Keywords

Cu nanoparticles
Low-temperature bonding
High conductivity
Oxidation-enhanced bonding

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title = "The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement",

abstract = "Highly conductive and robust Cu-Cu jonts are achieved by the low temperature sintering of Cu nanoparticles (Cu NPs) with a formic acid treatment. When sintered at 300 °C, the Cu-Cu joints exhibited a low resistivity of 4.79 µΩ·cm with a shear strength larger than 30 MPa. In addition, unique oxidation-enhancing effect of Cu-Cu joints is discovered in thermal storage experiments. When thermal storage at 50 h, the strength of the joints increases to 39.25 MPa, while the resistivity is only increased by a factor of 5.78. This discovery provides a potential packaging enhancement process for practical application of electronic devices.",

keywords = "Cu nanoparticles, Low-temperature bonding, High conductivity, Oxidation-enhanced bonding",

author = "Dongfang Dai and Jincheng Li and Jing Qian and Zeping Wang and Kai Zheng and Jiabing Yu and Xianping Chen",

note = "This work was supported in part by the National Natural Science Foundation of China under Grant 62071073 and in part by the Foundation from Guangxi Key Laboratory of Optoelectronic Information Processing under Grant GD20201.",

year = "2023",

doi = "10.1016/j.matlet.2023.134087",

language = "English",

volume = "339",

journal = "Materials Letters",

issn = "0167-577X",

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TY - JOUR

T1 - The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement

AU - Dai, Dongfang

AU - Li, Jincheng

AU - Qian, Jing

AU - Wang, Zeping

AU - Zheng, Kai

AU - Yu, Jiabing

AU - Chen, Xianping

N1 - This work was supported in part by the National Natural Science Foundation of China under Grant 62071073 and in part by the Foundation from Guangxi Key Laboratory of Optoelectronic Information Processing under Grant GD20201.

PY - 2023

Y1 - 2023

N2 - Highly conductive and robust Cu-Cu jonts are achieved by the low temperature sintering of Cu nanoparticles (Cu NPs) with a formic acid treatment. When sintered at 300 °C, the Cu-Cu joints exhibited a low resistivity of 4.79 µΩ·cm with a shear strength larger than 30 MPa. In addition, unique oxidation-enhancing effect of Cu-Cu joints is discovered in thermal storage experiments. When thermal storage at 50 h, the strength of the joints increases to 39.25 MPa, while the resistivity is only increased by a factor of 5.78. This discovery provides a potential packaging enhancement process for practical application of electronic devices.

AB - Highly conductive and robust Cu-Cu jonts are achieved by the low temperature sintering of Cu nanoparticles (Cu NPs) with a formic acid treatment. When sintered at 300 °C, the Cu-Cu joints exhibited a low resistivity of 4.79 µΩ·cm with a shear strength larger than 30 MPa. In addition, unique oxidation-enhancing effect of Cu-Cu joints is discovered in thermal storage experiments. When thermal storage at 50 h, the strength of the joints increases to 39.25 MPa, while the resistivity is only increased by a factor of 5.78. This discovery provides a potential packaging enhancement process for practical application of electronic devices.

KW - Cu nanoparticles

KW - Low-temperature bonding

KW - High conductivity

KW - Oxidation-enhanced bonding

U2 - 10.1016/j.matlet.2023.134087

DO - 10.1016/j.matlet.2023.134087

M3 - Letter

SN - 0167-577X

VL - 339

JO - Materials Letters

JF - Materials Letters

M1 - 134087

ER -

The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement

Abstract

Bibliographical note

Keywords

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