The effect of soft bake temperature on the polymerization of SU-8 photoresist

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Original language	English
Journal	Journal of Micromechanics and Microengineering
Volume	16
Issue number	9
Pages (from-to)	1819
ISSN	0960-1317
DOIs	https://doi.org/10.1088/0960-1317/16/9/009
Publication status	Published - 2006

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@article{e2911f7064a9428ba985e5e205952352,

title = "The effect of soft bake temperature on the polymerization of SU-8 photoresist",

author = "Anh{\o}j, {Thomas Aar{\o}e} and J{\o}rgensen, {Anders Michael} and Dan Zauner and J{\"o}rg H{\"u}bner",

year = "2006",

doi = "10.1088/0960-1317/16/9/009",

language = "English",

volume = "16",

pages = "1819",

journal = "Journal of Micromechanics and Microengineering",

issn = "0960-1317",

publisher = "IOP Publishing",

number = "9",

}

TY - JOUR

T1 - The effect of soft bake temperature on the polymerization of SU-8 photoresist

AU - Anhøj, Thomas Aarøe

AU - Jørgensen, Anders Michael

AU - Zauner, Dan

AU - Hübner, Jörg

PY - 2006

Y1 - 2006

U2 - 10.1088/0960-1317/16/9/009

DO - 10.1088/0960-1317/16/9/009

M3 - Journal article

SN - 0960-1317

VL - 16

SP - 1819

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

IS - 9

ER -