TEM Investigations of Cold Roll Bonded Al/Cu Interface

K Mogensen, A Thölen, Niels Bay, Wenqi Zhang

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Proceed. 46th Ann. Meet. in The Scandinavian Society for Electron Microscopy
Publication date	1994
Pages	148-149
Publication status	Published - 1994
Event	46th Annual Meeting of the Scandinavian Society for Electron Microscopy - Kuopio, Finland Duration: 13 Jun 1994 → 15 Jun 1994

Conference	46th Annual Meeting of the Scandinavian Society for Electron Microscopy
Country/Territory	Finland
City	Kuopio
Period	13/06/1994 → 15/06/1994

OpenUrl availability

@inproceedings{37c99d28dbc14ac68af363f9644997eb,

title = "TEM Investigations of Cold Roll Bonded Al/Cu Interface",

author = "K Mogensen and A Th{\"o}len and Niels Bay and Wenqi Zhang",

year = "1994",

language = "English",

pages = "148--149",

booktitle = "Proceed. 46th Ann. Meet. in The Scandinavian Society for Electron Microscopy",

note = "46th Annual Meeting of the Scandinavian Society for Electron Microscopy ; Conference date: 13-06-1994 Through 15-06-1994",

}

TY - GEN

T1 - TEM Investigations of Cold Roll Bonded Al/Cu Interface

AU - Mogensen, K

AU - Thölen, A

AU - Bay, Niels

AU - Zhang, Wenqi

PY - 1994

Y1 - 1994

M3 - Article in proceedings

SP - 148

EP - 149

BT - Proceed. 46th Ann. Meet. in The Scandinavian Society for Electron Microscopy

T2 - 46th Annual Meeting of the Scandinavian Society for Electron Microscopy

Y2 - 13 June 1994 through 15 June 1994

ER -