Abstract
In this work we present an easy, fast, reliable and low cost microfabrication technique for fabricating suspended microstructures of epoxy based photoresistswith UV photolithography. Two different fabrication processes with
epoxy based resins (SU-8 and mr-DWL) using UV exposures at wavelengths of 313 nm and 405 nm were optimized and compared in terms of structural stability, control of suspended layer thickness and resolution limits. A novel fabrication process combining the two photoresists SU-8 and mr-DWL with two UV exposures at 365 nm and 405 nm respectively provided a wider processing window for definition of well-defined suspended microstructures with lateral dimensions down to 5 μmwhen compared to 313 nm or 365 nm UV photolithography processes.
epoxy based resins (SU-8 and mr-DWL) using UV exposures at wavelengths of 313 nm and 405 nm were optimized and compared in terms of structural stability, control of suspended layer thickness and resolution limits. A novel fabrication process combining the two photoresists SU-8 and mr-DWL with two UV exposures at 365 nm and 405 nm respectively provided a wider processing window for definition of well-defined suspended microstructures with lateral dimensions down to 5 μmwhen compared to 313 nm or 365 nm UV photolithography processes.
| Original language | English |
|---|---|
| Journal | Microelectronic Engineering |
| Volume | 176 |
| Pages (from-to) | 40-44 |
| ISSN | 0167-9317 |
| DOIs | |
| Publication status | Published - 2017 |
Keywords
- 405 nm UV photolithography
- Suspended microstructures
- SU-8
- mr-DWL