Abstract
| Original language | English |
|---|---|
| Publication date | 2016 |
| Number of pages | 1 |
| Publication status | Published - 2016 |
| Event | Materials Science and Technology 2016 - Salt Palace Convention Center, Salt Lake City, UT, United States Duration: 23 Oct 2016 → 27 Oct 2016 http://www.matscitech.org |
Conference
| Conference | Materials Science and Technology 2016 |
|---|---|
| Location | Salt Palace Convention Center |
| Country | United States |
| City | Salt Lake City, UT |
| Period | 23/10/2016 → 27/10/2016 |
| Internet address |
Cite this
}
Surface characterization of activated chalcopyrite particles via the FLSmidth ROL process. Part 1: Electron microscope investigations. / Karcz, Adam Paul; Damø, Anne Juul; Illerup, Jytte Boll; Rocks, Sally ; Dam-Johansen, Kim; Chaiko, David .
2016. Abstract from Materials Science and Technology 2016, Salt Lake City, UT, United States.Research output: Contribution to conference › Conference abstract for conference › Research › peer-review
TY - ABST
T1 - Surface characterization of activated chalcopyrite particles via the FLSmidth ROL process. Part 1: Electron microscope investigations
AU - Karcz, Adam Paul
AU - Damø, Anne Juul
AU - Illerup, Jytte Boll
AU - Rocks, Sally
AU - Dam-Johansen, Kim
AU - Chaiko, David
PY - 2016
Y1 - 2016
N2 - Because of its unique semiconductor properties, the world’s most abundant copper mineral (chalcopyrite) is refractory with respect to atmospheric leaching using traditional ferric sulfate lixiviants. A novel approach to address this issue – conducted at FLSmidth – utilizes a mechanochemical Rapid Oxidative Leach (ROL) assisted by a Stirred Media Reactor (SMRt). Due to the elimination of much of the surface passivation problems associated with atmospheric leaching, this process is able to attain copper recoveries >97% in under 6 hours. An optional, rapid preconditioning step uses minute quantities of copper(II) to dope the semiconductor lattice and thereby "activate" the chalcopyrite, thereby reducing leach times below 2 hours (>98% recovery). Because the activation plays a major role in accelerating the leaching step, it is critical to understand the nature of this intermediate and its part in the ROL process. The current work presents results from electron microscope investigations of surface-activated particles.
AB - Because of its unique semiconductor properties, the world’s most abundant copper mineral (chalcopyrite) is refractory with respect to atmospheric leaching using traditional ferric sulfate lixiviants. A novel approach to address this issue – conducted at FLSmidth – utilizes a mechanochemical Rapid Oxidative Leach (ROL) assisted by a Stirred Media Reactor (SMRt). Due to the elimination of much of the surface passivation problems associated with atmospheric leaching, this process is able to attain copper recoveries >97% in under 6 hours. An optional, rapid preconditioning step uses minute quantities of copper(II) to dope the semiconductor lattice and thereby "activate" the chalcopyrite, thereby reducing leach times below 2 hours (>98% recovery). Because the activation plays a major role in accelerating the leaching step, it is critical to understand the nature of this intermediate and its part in the ROL process. The current work presents results from electron microscope investigations of surface-activated particles.
M3 - Conference abstract for conference
ER -