Abstract
A supramolecular conductive polymer composition comprising; a polymer comprising repeating subunits comprising at least one functional group, for forming a part in a hydrogen bond, selected from alcohol, amine, ether, amide, carboxylic acid, ester, ketone, nitrile, aldehyde and carbamide; a polyphenol comprising a minimum of 12 aromatic hydroxyl groups; a solvent with a dielectric constant of at least 20; and an electrically conductive filler.
| Original language | English |
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| IPC | G01L 1/ 18 A I |
| Patent number | WO2021110743 |
| Filing date | 02/12/2020 |
| Country/Territory | International Bureau of the World Intellectual Property Organization (WIPO) |
| Priority date | 02/12/2019 |
| Priority number | EP20190212902 |
| Publication status | Published - 10 Jun 2021 |