Sulfur ligand mediated electrochemistry of gold surfaces and nanoparticles: what, how, and why

Qijin Chi, Michael J. Ford, Arnab Halder, Noel S. Hush, Jeffrey R. Reimers, Jens Ulstrup

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Abstract

Gold surfaces are widely used in electrochemistry whilst gold nanoparticles have very many uses, with both the surfaces and the particles often being protected by sulfur-bound organic ligands. The ligands not only provide chemical stability but also directly participate in many desired processes. This review considers the diversity of known atomic structures for gold-sulfur interfaces, how these structures facilitate a diversity of mechanisms in electrochemical applications, and why this is possible based on recent advances in the basic understanding of the electronic structure of gold-sulfur bonds. Believed once to be Au(I)-thiolate in character and hence distinctly different to physisorbed thiols and disulfides, chemisorbed bonds are shown to be Au(0)-thiyls instead. A wide range of in-situ STM electrochemical and other data is interpreted from this perspective.
Original languageEnglish
JournalCurrent Opinion in Electrochemistry
Volume1
Issue number1
Pages (from-to)7-15
ISSN2451-9103
DOIs
Publication statusPublished - 2017

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