Submicron three-dimensional structures fabricated by reverse contact UV nanoimprint lithography

N. Kehagias, Vincent Reboud, G. Chansin, M. Zelsmann, Claus Jeppesen, F. Reuther, C. Schuster, M. Kubenz, G. Gruetzner, C.M.S. Torres

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    Abstract

    The fabrication of a three-dimensional multilayered nanostructure is demonstrated with a newly developed nanofabrication technique, namely, reverse contact ultraviolet nanoimprint lithography. This technique is a combination of reverse nanoimprint lithography and contact ultraviolet lithography. In this process, a UV cross-linkable polymer and a thermoplastic polymer are spin coated onto a patterned hybrid metal-quartz stamp. These thin polymer films are then transferred from the stamp to the substrate by contact at a suitable temperature and pressure. The whole assembly is then exposed to UV light. After separation of the stamp and the substrate, the unexposed polymer areas are rinsed away with acetone leaving behind the negative features of the original stamp with no residual layer.
    Original languageEnglish
    JournalJournal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures
    Volume24
    Issue number6
    Pages (from-to)3002-3005
    ISSN1071-1023
    DOIs
    Publication statusPublished - 2006

    Cite this

    Kehagias, N., Reboud, V., Chansin, G., Zelsmann, M., Jeppesen, C., Reuther, F., Schuster, C., Kubenz, M., Gruetzner, G., & Torres, C. M. S. (2006). Submicron three-dimensional structures fabricated by reverse contact UV nanoimprint lithography. Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures, 24(6), 3002-3005. https://doi.org/10.1116/1.2388962