Stacked Silicon Microphones

M. Müllenborn, Pirmin Rombach, Udo Klein, K. Rasmussen, Jochen Kuhmann, M. Heschel, S. Bouwstra, M. Amskov, Jakob Janting, A. Hoogerwerf

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

This paper presents results on the first silicon microphones that are completely batchpackaged and integrated with signal conditioning circuitry in a chip stack. The chip stack is designed to be directly mountable into a system, such as a hearing instrument, without further single-chip handling or wire bonding. The devices are fully encapsulated and provided with a well-determined interface to the environment. The integrated microphones operate at a bias of 1.5 V and are expected to reach a sensitivity of 5 mV/Pa, an equivalent input noise of 24 dBA SPL, and a power consumption of about 50 μW in the near future, thereby living up to the tight specifications of microphones for hearing instruments. Other potential applications include mobile phones, headsets, and wearable computers, in which space is constrained.
Original languageEnglish
Title of host publicationEUROSENSORS XIV. Proceedings of the 14. European Conference on Solid-State Transducers
Publication date2000
Pages209-212
ISBN (Print)87-89935-50-0
Publication statusPublished - 2000
Externally publishedYes
Event14. European Conference on Solid-State Transducers - Copenhagen, Denmark
Duration: 27 Aug 200030 Aug 2000
Conference number: 14

Conference

Conference14. European Conference on Solid-State Transducers
Number14
CountryDenmark
CityCopenhagen
Period27/08/200030/08/2000

Keywords

  • Microphone
  • Acoustic transducers
  • Stacking
  • Packaging

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