Stacked multi-chip-module technology for microsystems

Siebe Bouwstra

    Research output: Chapter in Book/Report/Conference proceedingBook chapterResearchpeer-review

    Original languageEnglish
    Title of host publicationISHM-Nordic
    Place of PublicationHelsingør, Denmark
    Publication date1996
    Pages49-52
    Publication statusPublished - 1996

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