| Original language | English |
|---|---|
| Title of host publication | Micromachined Devices and Components II: Proc. of SPIE, 2882 |
| Place of Publication | Austin, Texas |
| Publication date | 1996 |
| Pages | 49-52 |
| Publication status | Published - 1996 |
Stacked multi-chip-module technology for high performance intelligent transducers
Siebe Bouwstra
Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review