Stacked multi-chip-module technology for high performance intelligent transducers

Siebe Bouwstra

    Research output: Chapter in Book/Report/Conference proceedingBook chapterResearchpeer-review

    Original languageEnglish
    Title of host publicationMicromachined Devices and Components II: Proc. of SPIE, 2882
    Place of PublicationAustin, Texas
    Publication date1996
    Pages49-52
    Publication statusPublished - 1996

    Cite this

    Bouwstra, S. (1996). Stacked multi-chip-module technology for high performance intelligent transducers. In Micromachined Devices and Components II: Proc. of SPIE, 2882 (pp. 49-52). Austin, Texas.
    Bouwstra, Siebe. / Stacked multi-chip-module technology for high performance intelligent transducers. Micromachined Devices and Components II: Proc. of SPIE, 2882. Austin, Texas, 1996. pp. 49-52
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    author = "Siebe Bouwstra",
    year = "1996",
    language = "English",
    pages = "49--52",
    booktitle = "Micromachined Devices and Components II: Proc. of SPIE, 2882",

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    Bouwstra, S 1996, Stacked multi-chip-module technology for high performance intelligent transducers. in Micromachined Devices and Components II: Proc. of SPIE, 2882. Austin, Texas, pp. 49-52.

    Stacked multi-chip-module technology for high performance intelligent transducers. / Bouwstra, Siebe.

    Micromachined Devices and Components II: Proc. of SPIE, 2882. Austin, Texas, 1996. p. 49-52.

    Research output: Chapter in Book/Report/Conference proceedingBook chapterResearchpeer-review

    TY - CHAP

    T1 - Stacked multi-chip-module technology for high performance intelligent transducers

    AU - Bouwstra, Siebe

    PY - 1996

    Y1 - 1996

    M3 - Book chapter

    SP - 49

    EP - 52

    BT - Micromachined Devices and Components II: Proc. of SPIE, 2882

    CY - Austin, Texas

    ER -

    Bouwstra S. Stacked multi-chip-module technology for high performance intelligent transducers. In Micromachined Devices and Components II: Proc. of SPIE, 2882. Austin, Texas. 1996. p. 49-52