Solid state silicon based condenser microphone for hearing aid, has transducer chip and IC chip between intermediate chip and openings on both sides of intermediate chip, to allow sound towards diaphragm

Ole Hansen (Inventor), Matthias Heschel (Inventor), Siebe Bouwstra (Inventor), Matthias Müllenborn (Inventor), H. Hvims (Inventor), Pirmin Rombach (Inventor), M. A. Gravad (Inventor)

    Research output: Patent

    Abstract

    NOVELTY - A silicon transducer chip (1) has parallel backplate and movable diaphragm (12) and forms an electrical capacitor. The chip and electronic circuit chip (3) are provided on either sides of intermediate chip (2). The chip (2) has openings (4,10) between two sides of the chip, to allow sound towards diaphragm. Surface of the chip (2) has electrical conductors (14) to connect chip with IC chip (3). USE - For use in miniature electroacoustic devices such as hearing aid. ADVANTAGE - Since sound inlet is covered by filter, dust, moisture and other impurities do not obstruct interior and sound inlet of microphone. External electrical connection can be made economically reliable and the thermal stress is avoided with the small size solid state silicon based condenser microphone.
    Original languageEnglish
    Patent numberUS6088463-A
    Filing date11/07/2000
    CountryUnited States
    Publication statusPublished - 2000

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