Solder mask surface properties and related PCBA failure due to build-up of water layer

Anish Rao Lakkaraju, Helene Conseil-Gudla, Frantisek Steiner, Rajan Ambat

    Research output: Contribution to conference › Conference abstract for conference › Research

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    Original languageEnglish
    Publication date2021
    Number of pages1
    Publication statusPublished - 2021
    EventEUROCORR 2021: European Corrosion Congress - Virtual, Budapest, Hungary
    Duration: 20 Sept 2021 → 24 Sept 2021
    Conference number: 447
    https://eurocorr.org/

    Conference

    ConferenceEUROCORR 2021
    Number447
    LocationVirtual
    Country/TerritoryHungary
    CityBudapest
    Period20/09/2021 → 24/09/2021
    Internet address

    Keywords

    • Humidity
    • Impedance
    • Printed circuit board laminate
    • Solder mask
    • Surface roughness
    • Temperature
    • Water layer formation

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