Solder mask surface properties and related PCBA failure due to build-up of water layer

Anish Rao Lakkaraju; Helene Conseil-Gudla; Frantisek Steiner; Rajan Ambat

Solder mask surface properties and related PCBA failure due to build-up of water layer

Anish Rao Lakkaraju, Helene Conseil-Gudla, Frantisek Steiner, Rajan Ambat

Research output: Contribution to conference › Conference abstract for conference › Research

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Original language	English
Publication date	2021
Number of pages	1
Publication status	Published - 2021
Event	EUROCORR 2021: European Corrosion Congress - Virtual, Budapest, Hungary Duration: 20 Sep 2021 → 24 Sep 2021 Conference number: 447 https://eurocorr.org/

Conference

Conference	EUROCORR 2021
Number	447
Location	Virtual
Country/Territory	Hungary
City	Budapest
Period	20/09/2021 → 24/09/2021
Internet address	https://eurocorr.org/

Keywords

Humidity
Impedance
Printed circuit board laminate
Solder mask
Surface roughness
Temperature
Water layer formation

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341179_Anish_Lakkaraju_Eurocorr_2021Final published version, 32.2 KB

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Solder mask surface properties and related PCBA failure due to build-up of water layer
Anish Rao Lakkaraju (Speaker), Helene Virginie Conseil Gudla (Other), Frantisek Steiner (Other) & Rajan Ambat (Lecturer)
21 Sep 2021
Activity: Talks and presentations › Conference presentations

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title = "Solder mask surface properties and related PCBA failure due to build-up of water layer",

keywords = "Humidity, Impedance, Printed circuit board laminate, Solder mask, Surface roughness, Temperature, Water layer formation",

author = "Lakkaraju, {Anish Rao} and Helene Conseil-Gudla and Frantisek Steiner and Rajan Ambat",

year = "2021",

language = "English",

note = "EUROCORR 2021 : European Corrosion Congress, European Federation of Corrosion (EFC) ; Conference date: 20-09-2021 Through 24-09-2021",

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TY - ABST

T1 - Solder mask surface properties and related PCBA failure due to build-up of water layer

AU - Lakkaraju, Anish Rao

AU - Conseil-Gudla, Helene

AU - Steiner, Frantisek

AU - Ambat, Rajan

N1 - Conference code: 447

PY - 2021

Y1 - 2021

KW - Humidity

KW - Impedance

KW - Printed circuit board laminate

KW - Solder mask

KW - Surface roughness

KW - Temperature

KW - Water layer formation

M3 - Conference abstract for conference

T2 - EUROCORR 2021

Y2 - 20 September 2021 through 24 September 2021

ER -

Solder mask surface properties and related PCBA failure due to build-up of water layer

Conference

Keywords

Access to Document

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Activities

Solder mask surface properties and related PCBA failure due to build-up of water layer

Cite this