Single-pulse femtosecond laser ablation of monocrystalline silicon: a modeling and experimental study

Chong Chen, Fan Zhang, Yang Zhang, Xin Xiong, Bing-Feng Ju, Hailong Cui, Yuan-Liu Chen*

*Corresponding author for this work

    Research output: Contribution to journalJournal articleResearchpeer-review

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    Abstract

    In this paper, a visualization model by using the COMSOL® Multiphysics was established to investigate the quantitative relationship between the parameters of the single-pulse femtosecond laser and the geometries of the ablated monocrystalline silicon micro-holes. Monocrystalline silicon was ablated with different femtosecond laser single-pulse energies and the diameters as well as the depths of the obtained micro-holes were compared with the prediction results of the established visualization model. The comparison results have demonstrated that the single-pulse femtosecond laser ablation results can be predicted effectively based on the established visualization model. The prediction error of the ablated micro-hole diameter and depth were within 2.31% and 15.40%, respectively, without any prior optimization experiments. It is thus possible to precisely conduct femtosecond laser ablation on monocrystalline silicon for desired geometries by utilizing appropriate parameters without trial-and-errors as in traditional femtosecond laser ablation technologies.
    Original languageEnglish
    Article number151722
    JournalApplied Surface Science
    Volume576
    Number of pages9
    ISSN0169-4332
    DOIs
    Publication statusPublished - 2022

    Keywords

    • Femtosecond laser
    • Single-pulse ablation
    • Monocrystalline silicon
    • Visualization model

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