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Simulated SAM A-scans on multilayer MEMS components

    • Danfoss AS

    Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

    701 Downloads (Orbit)
    Original languageEnglish
    Title of host publicationProceedings of Workshop on MEMS Sensor Packaging.
    Number of pages2
    Publication date2003
    ISBN (Print)87-89935-46-2
    Publication statusPublished - 2003
    EventWorkshop on MEMS Sensor Packaging - Technical University of Denmark, Lyngby, Denmark
    Duration: 20 Mar 2003 → 21 Mar 2003

    Conference

    ConferenceWorkshop on MEMS Sensor Packaging
    LocationTechnical University of Denmark
    Country/TerritoryDenmark
    CityLyngby
    Period20/03/2003 → 21/03/2003

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