Simulated SAM A-scans on multilayer MEMS components

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Original languageEnglish
Title of host publicationProceedings of Workshop on MEMS Sensor Packaging.
Number of pages2
Publication date2003
ISBN (Print)87-89935-46-2
Publication statusPublished - 2003
EventWorkshop on MEMS Sensor Packaging - Technical University of Denmark, Lyngby, Denmark
Duration: 20 Mar 200321 Mar 2003

Conference

ConferenceWorkshop on MEMS Sensor Packaging
LocationTechnical University of Denmark
CountryDenmark
CityLyngby
Period20/03/200321/03/2003

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