Silicon photonics for quantum communication

Y. Ding, D. Bacco, D. Llewellyn, I. Faruque, S. Paesani, M. Galili, A. Laing, K. Rottwitt, M. Thompson, J. Wang, L. K. Oxenløwe

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

Silicon quantum photonics, capable to integrate large numbers of optical components with CMOS-compatible fabrication technology and reliable control of quantum states, is expected to play a critical role in future quantum communication. In this talk, we will introduce our recent results of silicon photonics for quantum communication, including high-dimensional silicon chip-to-chip quantum key distribution, chip-to-chip quantum teleportation, on-chip generation of high-dimensional quantum entanglement, and Hong-Ou-Mandel interference between two different III-V/silicon hybrid lasers towards future measurement device independent quantum communication.

Original languageEnglish
Title of host publicationProceedings of 21st International Conference on Transparent Optical Networks
PublisherIEEE Computer Society Press
Publication date1 Jul 2019
Article number8840038
ISBN (Electronic)9781728127798
DOIs
Publication statusPublished - 1 Jul 2019
Event21st International Conference on Transparent Optical Networks - Faculty of Science, University of Angers, Angers, France
Duration: 9 Jul 201913 Jul 2019
http://www.icton2019.com/

Conference

Conference21st International Conference on Transparent Optical Networks
LocationFaculty of Science, University of Angers
CountryFrance
CityAngers
Period09/07/201913/07/2019
SponsorApex Technologies, Institut des Sciences de l'Evolution, MDPI, Lumomat, Moltech-Anjou, Springer Nature Switzerland AG
Internet address

Keywords

  • High-dimensional quantum photonics
  • Hong-Ou-Mandel interference
  • Quantum communication
  • Quantum entanglement
  • Quantum key distribution
  • Silicon photonics

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