Selected process chains for manufacturing of moulded interconnect devices (MID)

Hans Nørgaard Hansen; Peter Torben Tang; Mohammad Aminul Islam; Guido Tosello

Selected process chains for manufacturing of moulded interconnect devices (MID)

Hans Nørgaard Hansen, Peter Torben Tang, Mohammad Aminul Islam, Guido Tosello

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Original language	English
Title of host publication	Proceedings of the 7th international conference and 9th annual general meeting of euspen
Volume	Volume I
Place of Publication	Cranfield, UK
Publisher	eudpen
Publication date	2007
Pages	176-179
ISBN (Print)	978-0-9553082-2-2
Publication status	Published - 2007
Event	7th International Conference and 9th Annual General Meeting of the European Society for Precision Engineering and Nanotechnology. - Bremen, Germany Duration: 20 May 2007 → 24 May 2007

Conference

Conference	7th International Conference and 9th Annual General Meeting of the European Society for Precision Engineering and Nanotechnology.
Country/Territory	Germany
City	Bremen
Period	20/05/2007 → 24/05/2007

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Cite this

@inproceedings{f789a716cd1a435fada1e6f0b4161c09,

title = "Selected process chains for manufacturing of moulded interconnect devices (MID)",

author = "Hansen, {Hans N{\o}rgaard} and Tang, {Peter Torben} and Islam, {Mohammad Aminul} and Guido Tosello",

year = "2007",

language = "English",

isbn = "978-0-9553082-2-2",

volume = "Volume I",

pages = "176--179",

booktitle = "Proceedings of the 7th international conference and 9th annual general meeting of euspen",

publisher = "eudpen",

note = "7th International Conference and 9th Annual General Meeting of the European Society for Precision Engineering and Nanotechnology. ; Conference date: 20-05-2007 Through 24-05-2007",

}

Hansen, HN, Tang, PT, Islam, MA & Tosello, G 2007, Selected process chains for manufacturing of moulded interconnect devices (MID). in Proceedings of the 7th international conference and 9th annual general meeting of euspen. vol. Volume I, eudpen, Cranfield, UK, pp. 176-179, 7th International Conference and 9th Annual General Meeting of the European Society for Precision Engineering and Nanotechnology., Bremen, Germany, 20/05/2007.

Selected process chains for manufacturing of moulded interconnect devices (MID). / Hansen, Hans Nørgaard; Tang, Peter Torben; Islam, Mohammad Aminul et al.
Proceedings of the 7th international conference and 9th annual general meeting of euspen. Vol. Volume I Cranfield, UK: eudpen, 2007. p. 176-179.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Selected process chains for manufacturing of moulded interconnect devices (MID)

AU - Hansen, Hans Nørgaard

AU - Tang, Peter Torben

AU - Islam, Mohammad Aminul

AU - Tosello, Guido

PY - 2007

Y1 - 2007

M3 - Article in proceedings

SN - 978-0-9553082-2-2

VL - Volume I

SP - 176

EP - 179

BT - Proceedings of the 7th international conference and 9th annual general meeting of euspen

PB - eudpen

CY - Cranfield, UK

T2 - 7th International Conference and 9th Annual General Meeting of the European Society for Precision Engineering and Nanotechnology.

Y2 - 20 May 2007 through 24 May 2007

ER -