Selected process chains for manufacturing of moulded interconnect devices (MID)

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationProceedings of the 7th international conference and 9th annual general meeting of euspen
    VolumeVolume I
    Place of PublicationCranfield, UK
    Publishereudpen
    Publication date2007
    Pages176-179
    ISBN (Print)978-0-9553082-2-2
    Publication statusPublished - 2007
    EventProceedings of the 7th international conference and 9th annual general meeting of euspen - Bremen, Germany
    Duration: 1 Jan 2007 → …

    Conference

    ConferenceProceedings of the 7th international conference and 9th annual general meeting of euspen
    CityBremen, Germany
    Period01/01/2007 → …

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