Scanning Acoustic Microscopy Study of Flip-Chip Underfill Cure Degree

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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    Original languageEnglish
    Title of host publicationProceedings of Materials Week conference
    Number of pages8
    Publication date2002
    Publication statusPublished - 2002
    EventEuropean Conference on Advanced Materials - International Congress Centre, Munich., Munich, Germany
    Duration: 30 Sep 20022 Oct 2002

    Conference

    ConferenceEuropean Conference on Advanced Materials
    LocationInternational Congress Centre, Munich.
    Country/TerritoryGermany
    CityMunich
    Period30/09/200202/10/2002

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