Scanning Acoustic Microscopy Investigation of Adhesive Cure Degree.

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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    Original languageEnglish
    Title of host publicationProceedings of Workshop on MEMS Sensor Packaging.
    Number of pages2
    Publication date2003
    ISBN (Print)87-89935-46-2
    Publication statusPublished - 2003
    EventWorkshop on MEMS Sensor Packaging - Technical University of Denmark, Lyngby, Denmark
    Duration: 20 Mar 200321 Mar 2003

    Conference

    ConferenceWorkshop on MEMS Sensor Packaging
    LocationTechnical University of Denmark
    CountryDenmark
    CityLyngby
    Period20/03/200321/03/2003

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