The role of the common stress factors such as high temperature, humidity,and UV irradiation on interface adhesion of roll-to-roll fabricated organic photovoltaic (OPV) devices is investigated. The samples range from bare front electrodes to complete devices. It is shown that applying single stress or combinations of stresses onto the samples variably affect the adhesion properties of the different interfaces in the OPV device. It is revealed that while the exposure of the complete devices to the stresses results in the loss of photovoltaic performance, some interfaces in the devices present improved adhesion properties. Depth profiling analysis on the fractured samples reveals interdiffusion of layers in the structure, which results in the increase of adhesion and change of the debond path. It is shown that through diffusion and intermixing of internal interfaces coupled stresses can increase the adhesion of OPV interfaces by over tenfold. The results are additionally compared to the photovoltaic performance of the complete devices.