RIE-lag “Correction” in Bosch Etch Process of Silicon to Enable Profile Straightness and Improved Scallop Size Distribution

Research output: Contribution to conferenceConference abstract for conference – Annual report year: 2018Researchpeer-review

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Original languageEnglish
Publication date2017
Publication statusPublished - 2017
Event43rd International conference on Micro and Nano Engineering - Braga, Portugal
Duration: 18 Sep 201722 Sep 2017
Conference number: 43

Conference

Conference43rd International conference on Micro and Nano Engineering
Number43
CountryPortugal
CityBraga
Period18/09/201722/09/2017

    Research areas

  • Plasma etching, Bosch process, RIE-lag, Scallops
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