RIE-lag “Correction” in Bosch Etch Process of Silicon to Enable Profile Straightness and Improved Scallop Size Distribution

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    Original languageEnglish
    Publication date2017
    Publication statusPublished - 2017
    Event43rd International conference on Micro and Nano Engineering - Braga, Portugal
    Duration: 18 Sep 201722 Sep 2017
    Conference number: 43

    Conference

    Conference43rd International conference on Micro and Nano Engineering
    Number43
    CountryPortugal
    CityBraga
    Period18/09/201722/09/2017

    Keywords

    • Plasma etching
    • Bosch process
    • RIE-lag
    • Scallops

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