RF 3D Assembly for High Density Photonic Circuits

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In this contribute we present the design of an innovative 3D RF interposer for high-density photonic integrated circuits (PICs). This 3D interposer has been designed to operate at frequencies up to 50GHz for applications exploiting 64GBaud/s modulations. An AlN substrate has been used for the fabrication and has been mounted with flip-chip technology and solder bumps reflow; a prototype using the proposed interposer and a high-speed amplitude modulator InP chip has been assembled to validate the approach and the simulations. The use a 3D interposer allows to ease the layout and to increase the photonic integration scale by managing the RF tracks routing outside the optical chip without impairing the performance; moreover, the interposer avoid proximity between the power-hungry high-speed electronics and the optical chip, resulting in a greatly reduced thermal crosstalk between these components and the optical chip.
Original languageEnglish
Title of host publicationProceedings of 20th Italian National Conference on Photonic Technologies
Number of pages4
PublisherInstitution of Engineering and Technology
Publication date2018
ISBN (Print)978-1-78561-991-5
Publication statusPublished - 2018
Event20th Italian National Conference on Photonic Technologies - Grand Hotel Tiziano e dei Congressi, Lecce, Italy
Duration: 23 May 201825 May 2018


Conference20th Italian National Conference on Photonic Technologies
LocationGrand Hotel Tiziano e dei Congressi
Series20th Italian National Conference on Photonic Technologies (fotonica 2018)
CitationsWeb of Science® Times Cited: No match on DOI

ID: 178277733