@inproceedings{94c48b32bedb449d8b584bdccd956492,
title = "RF 3D Assembly for High Density Photonic Circuits",
abstract = "In this contribute we present the design of an innovative 3D RF interposer for high-density photonic integrated circuits (PICs). This 3D interposer has been designed to operate at frequencies up to 50GHz for applications exploiting 64GBaud/s modulations. An AlN substrate has been used for the fabrication and has been mounted with flip-chip technology and solder bumps reflow; a prototype using the proposed interposer and a high-speed amplitude modulator InP chip has been assembled to validate the approach and the simulations. The use a 3D interposer allows to ease the layout and to increase the photonic integration scale by managing the RF tracks routing outside the optical chip without impairing the performance; moreover, the interposer avoid proximity between the power-hungry high-speed electronics and the optical chip, resulting in a greatly reduced thermal crosstalk between these components and the optical chip.",
author = "Andrea Annoni and Valeria Nocella and Yunfeng Dong and Johansen, {Tom Keinicke} and Antoine Dentin and Maziyar Milanizadeh and Antonello Vannucci",
year = "2018",
doi = "10.1049/cp.2018.1611",
language = "English",
isbn = "978-1-78561-991-5",
series = "20th Italian National Conference on Photonic Technologies (fotonica 2018)",
booktitle = "Proceedings of 20th Italian National Conference on Photonic Technologies",
publisher = "Institution of Engineering and Technology",
note = "20th Italian National Conference on Photonic Technologies , Fotonica 2018 ; Conference date: 23-05-2018 Through 25-05-2018",
}