Abstract
| Original language | English |
|---|---|
| Title of host publication | Proceedings of 20th Italian National Conference on Photonic Technologies |
| Number of pages | 4 |
| Publisher | Institution of Engineering and Technology |
| Publication date | 2018 |
| ISBN (Print) | 978-1-78561-991-5 |
| DOIs | |
| Publication status | Published - 2018 |
| Event | 20th Italian National Conference on Photonic Technologies - Grand Hotel Tiziano e dei Congressi, Lecce, Italy Duration: 23 May 2018 → 25 May 2018 |
Conference
| Conference | 20th Italian National Conference on Photonic Technologies |
|---|---|
| Location | Grand Hotel Tiziano e dei Congressi |
| Country | Italy |
| City | Lecce |
| Period | 23/05/2018 → 25/05/2018 |
| Series | 20th Italian National Conference on Photonic Technologies (fotonica 2018) |
|---|
Cite this
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RF 3D Assembly for High Density Photonic Circuits. / Annoni, Andrea; Nocella, Valeria; Dong, Yunfeng; Johansen, Tom Keinicke; Dentin, Antoine; Milanizadeh, Maziyar; Vannucci, Antonello.
Proceedings of 20th Italian National Conference on Photonic Technologies . Institution of Engineering and Technology, 2018. (20th Italian National Conference on Photonic Technologies (fotonica 2018)).Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review
TY - GEN
T1 - RF 3D Assembly for High Density Photonic Circuits
AU - Annoni, Andrea
AU - Nocella, Valeria
AU - Dong, Yunfeng
AU - Johansen, Tom Keinicke
AU - Dentin, Antoine
AU - Milanizadeh, Maziyar
AU - Vannucci, Antonello
PY - 2018
Y1 - 2018
N2 - In this contribute we present the design of an innovative 3D RF interposer for high-density photonic integrated circuits (PICs). This 3D interposer has been designed to operate at frequencies up to 50GHz for applications exploiting 64GBaud/s modulations. An AlN substrate has been used for the fabrication and has been mounted with flip-chip technology and solder bumps reflow; a prototype using the proposed interposer and a high-speed amplitude modulator InP chip has been assembled to validate the approach and the simulations. The use a 3D interposer allows to ease the layout and to increase the photonic integration scale by managing the RF tracks routing outside the optical chip without impairing the performance; moreover, the interposer avoid proximity between the power-hungry high-speed electronics and the optical chip, resulting in a greatly reduced thermal crosstalk between these components and the optical chip.
AB - In this contribute we present the design of an innovative 3D RF interposer for high-density photonic integrated circuits (PICs). This 3D interposer has been designed to operate at frequencies up to 50GHz for applications exploiting 64GBaud/s modulations. An AlN substrate has been used for the fabrication and has been mounted with flip-chip technology and solder bumps reflow; a prototype using the proposed interposer and a high-speed amplitude modulator InP chip has been assembled to validate the approach and the simulations. The use a 3D interposer allows to ease the layout and to increase the photonic integration scale by managing the RF tracks routing outside the optical chip without impairing the performance; moreover, the interposer avoid proximity between the power-hungry high-speed electronics and the optical chip, resulting in a greatly reduced thermal crosstalk between these components and the optical chip.
U2 - 10.1049/cp.2018.1611
DO - 10.1049/cp.2018.1611
M3 - Article in proceedings
SN - 978-1-78561-991-5
BT - Proceedings of 20th Italian National Conference on Photonic Technologies
PB - Institution of Engineering and Technology
ER -