Resistor-capacitor approach for modelling of temperature and humidity response inside electronic enclosures

Z. Staliulionis; S. Mohanty; J. H. Hattel

doi:10.1109/EuroSimE.2019.8724538

Resistor-capacitor approach for modelling of temperature and humidity response inside electronic enclosures

Z. Staliulionis^*, S. Mohanty, J. H. Hattel

^*Corresponding author for this work

FORCE Technology

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

Moisture is an important factor to reliability, functionality and durability of electronic devices. Nowadays, modelling tools have become an integral part of electronics design, because they are less expensive for searching the optimal design of moisture control. CFD and FEM are very time consuming due to their computational effort, therefore it is desirable to have a method such as well-known Resistor-Capacitor (RC) approach which is faster and has less spatial resolution. The paper concerns the development of an in-house code using the RC approach for simulating coupled heat and moisture transport inside electronic enclosure under non-isothermal conditions. Thereafter, the simulations results were compared with corresponding experiments in order to validate the developed code. Based on comparison with experiments, a new configuration RC model was developed for a more accurate humidity prediction. In general new RC model had the adsorption and desorption mechanisms included as a lumped capacitance for describing the surface of a wall on its both sides. Such modification improved the agreement with experiments.

Original language	English
Title of host publication	2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019)
Number of pages	7
Publisher	IEEE
Publication date	2019
Article number	8724538
ISBN (Electronic)	978-1-5386-8040-7
DOIs	https://doi.org/10.1109/EuroSimE.2019.8724538
Publication status	Published - 2019
Event	20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Hannover, Germany Duration: 24 Mar 2019 → 27 Mar 2019 Conference number: 20

Conference

Conference	20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Number	20
Country/Territory	Germany
City	Hannover
Period	24/03/2019 → 27/03/2019

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Staliulionis, Z., Mohanty, S., & Hattel, J. H. (2019). Resistor-capacitor approach for modelling of temperature and humidity response inside electronic enclosures. In 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019) Article 8724538 IEEE. https://doi.org/10.1109/EuroSimE.2019.8724538

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title = "Resistor-capacitor approach for modelling of temperature and humidity response inside electronic enclosures",

abstract = "Moisture is an important factor to reliability, functionality and durability of electronic devices. Nowadays, modelling tools have become an integral part of electronics design, because they are less expensive for searching the optimal design of moisture control. CFD and FEM are very time consuming due to their computational effort, therefore it is desirable to have a method such as well-known Resistor-Capacitor (RC) approach which is faster and has less spatial resolution. The paper concerns the development of an in-house code using the RC approach for simulating coupled heat and moisture transport inside electronic enclosure under non-isothermal conditions. Thereafter, the simulations results were compared with corresponding experiments in order to validate the developed code. Based on comparison with experiments, a new configuration RC model was developed for a more accurate humidity prediction. In general new RC model had the adsorption and desorption mechanisms included as a lumped capacitance for describing the surface of a wall on its both sides. Such modification improved the agreement with experiments.",

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Staliulionis, Z, Mohanty, S & Hattel, JH 2019, Resistor-capacitor approach for modelling of temperature and humidity response inside electronic enclosures. in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019)., 8724538, IEEE, 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Hannover, Lower Saxony, Germany, 24/03/2019. https://doi.org/10.1109/EuroSimE.2019.8724538

Resistor-capacitor approach for modelling of temperature and humidity response inside electronic enclosures. / Staliulionis, Z.; Mohanty, S.; Hattel, J. H.
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019). IEEE, 2019. 8724538.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Resistor-capacitor approach for modelling of temperature and humidity response inside electronic enclosures

AU - Staliulionis, Z.

AU - Mohanty, S.

AU - Hattel, J. H.

N1 - Conference code: 20

PY - 2019

Y1 - 2019

N2 - Moisture is an important factor to reliability, functionality and durability of electronic devices. Nowadays, modelling tools have become an integral part of electronics design, because they are less expensive for searching the optimal design of moisture control. CFD and FEM are very time consuming due to their computational effort, therefore it is desirable to have a method such as well-known Resistor-Capacitor (RC) approach which is faster and has less spatial resolution. The paper concerns the development of an in-house code using the RC approach for simulating coupled heat and moisture transport inside electronic enclosure under non-isothermal conditions. Thereafter, the simulations results were compared with corresponding experiments in order to validate the developed code. Based on comparison with experiments, a new configuration RC model was developed for a more accurate humidity prediction. In general new RC model had the adsorption and desorption mechanisms included as a lumped capacitance for describing the surface of a wall on its both sides. Such modification improved the agreement with experiments.

AB - Moisture is an important factor to reliability, functionality and durability of electronic devices. Nowadays, modelling tools have become an integral part of electronics design, because they are less expensive for searching the optimal design of moisture control. CFD and FEM are very time consuming due to their computational effort, therefore it is desirable to have a method such as well-known Resistor-Capacitor (RC) approach which is faster and has less spatial resolution. The paper concerns the development of an in-house code using the RC approach for simulating coupled heat and moisture transport inside electronic enclosure under non-isothermal conditions. Thereafter, the simulations results were compared with corresponding experiments in order to validate the developed code. Based on comparison with experiments, a new configuration RC model was developed for a more accurate humidity prediction. In general new RC model had the adsorption and desorption mechanisms included as a lumped capacitance for describing the surface of a wall on its both sides. Such modification improved the agreement with experiments.

U2 - 10.1109/EuroSimE.2019.8724538

DO - 10.1109/EuroSimE.2019.8724538

M3 - Article in proceedings

BT - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019)

PB - IEEE

T2 - 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Y2 - 24 March 2019 through 27 March 2019

ER -

Resistor-capacitor approach for modelling of temperature and humidity response inside electronic enclosures

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