Skip to main navigation Skip to search Skip to main content

Residual Stress Measurement across the Scales

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

29 Downloads (Orbit)

Abstract

Residual stresses are unavoidable in heat treatment and surface engineering and their presence can be advantageous or disastrous for the performance of components. Residual stresses cannot be measured directly, but are determined from strain measurements, either non-destructively from diffraction-based methods, or destructively from relaxation-based methods. In this presentation, three examples of stress determination from strain measurements showcase some of the possibilities. In the first example lattice strains are determined with energy dispersive analysis with synchrotron radiation in relation to the phase fraction during martensite formation in a soft martensitic stainless steel. The second example shows synchrotron lattice determination with energy dispersive analysis during in-situ tensile loading of super martensitic stainless steel containing reverted austenite. The third example concerns determination of residual stresses in internally oxidized bulk metallic glass with laboratory X-ray diffraction analysis of lattice strains and displacements by stress relaxation during incremental ring-core excavation of micron-scale columns with focused ion beam milling in an SEM.
Original languageEnglish
Title of host publicationProceedings of the IFHTSE 2024 : IFHTSE 2024: Proceedings of the 29th International Federation for Heat Treatment and Surface Engineering World Congress
PublisherASM International
Publication date2024
Pages234-238
DOIs
Publication statusPublished - 2024
EventIFHTSE 2024 - Cleveland, United States
Duration: 30 Sept 20243 Oct 2024

Conference

ConferenceIFHTSE 2024
Country/TerritoryUnited States
CityCleveland
Period30/09/202403/10/2024

Fingerprint

Dive into the research topics of 'Residual Stress Measurement across the Scales'. Together they form a unique fingerprint.

Cite this