Residual stress in thin-film anodic bonding

Steen Weichel, Roger De Reus, Siebe Bouwstra

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationResidual stress in thin-film anodic bonding
    PublisherIOP Publishing
    Publication date1999
    Pages47-50
    Publication statusPublished - 1999
    Event9th European Workshop on Micromechanics - Ulvik, Norway
    Duration: 3 Jun 19985 Jun 1998

    Workshop

    Workshop9th European Workshop on Micromechanics
    CountryNorway
    CityUlvik
    Period03/06/199805/06/1998

    Cite this

    Weichel, S., Reus, R. D., & Bouwstra, S. (1999). Residual stress in thin-film anodic bonding. In Residual stress in thin-film anodic bonding (pp. 47-50). IOP Publishing.