Reliability of industrial packaging for microsystems

Engineering

• Microsystem 100%
• Etch Rate 100%
• Feedthrough 100%
• Bond Strength 100%
• Elevated Temperature 50%
• Exposure Time 50%
• Temperature Change 50%
• Conventional Method 50%
• Wafer Bonding 50%
• Glass Layer 50%
• Sensor Output 50%
• Line Width 50%
• Bonding Process 50%
• Electron-Beam Evaporation 50%
• Glass Frit 50%
• Bonding Temperature 50%
• Mountings 50%
• Diamond-Like Carbon 50%
• Silicon Wafer 50%
• Thin Films 50%
• Aqueous Solution 50%
• Photoresist 50%

Material Science

• Mechanical Strength 100%
• Silicon 100%
• Silicon Wafer 50%
• Solution 50%
• Silicon Carbide 50%
• Protective Coating 50%
• Diamond Like Carbon Films 50%
• Film 50%
• Density 50%
• Linewidth 50%
• Amorphous Silicon 50%
• Thin Films 50%
• Tantalum Oxides 50%

Keyphrases

• Wafer Bonding Process 50%
• Output Drift 50%
• Large Sensors 50%
• Extended Exposure 50%
• Micromachined Sensor 50%
• Parylene C Coating 50%
• Glass Frit 50%
• Amorphous Silicon Carbide 50%